JPH0423336Y2 - - Google Patents

Info

Publication number
JPH0423336Y2
JPH0423336Y2 JP1985112726U JP11272685U JPH0423336Y2 JP H0423336 Y2 JPH0423336 Y2 JP H0423336Y2 JP 1985112726 U JP1985112726 U JP 1985112726U JP 11272685 U JP11272685 U JP 11272685U JP H0423336 Y2 JPH0423336 Y2 JP H0423336Y2
Authority
JP
Japan
Prior art keywords
leds
unit
led
circuit board
printed circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1985112726U
Other languages
English (en)
Japanese (ja)
Other versions
JPS6221562U (en]
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985112726U priority Critical patent/JPH0423336Y2/ja
Publication of JPS6221562U publication Critical patent/JPS6221562U/ja
Application granted granted Critical
Publication of JPH0423336Y2 publication Critical patent/JPH0423336Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
JP1985112726U 1985-07-23 1985-07-23 Expired JPH0423336Y2 (en])

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985112726U JPH0423336Y2 (en]) 1985-07-23 1985-07-23

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985112726U JPH0423336Y2 (en]) 1985-07-23 1985-07-23

Publications (2)

Publication Number Publication Date
JPS6221562U JPS6221562U (en]) 1987-02-09
JPH0423336Y2 true JPH0423336Y2 (en]) 1992-05-29

Family

ID=30993866

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985112726U Expired JPH0423336Y2 (en]) 1985-07-23 1985-07-23

Country Status (1)

Country Link
JP (1) JPH0423336Y2 (en])

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010003756A (ja) * 2008-06-18 2010-01-07 Panasonic Electric Works Co Ltd Ｌｅｄ発光装置、プリント配線基板及び表示器具

Also Published As

Publication number Publication date
JPS6221562U (en]) 1987-02-09

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